5G Modular Base Station Interconnect

Providing high-speed data and RF signal connectivity solutions for the radio units, baseband units, and antenna filter units in 5G base station equipment with our BTB board-to-board connectors. Featuring ultra-fine 0.4mm-0.5mm pitches to meet high-density interconnect demands, these connectors deliver superior SI performance to ensure 5G high-frequency signal integrity.

5G Base Stations RF Modules Baseband Units Antenna Systems Small Cells

Features

Key Advantages

0.4mm Fine Pitch High Density

Stacking height: 1.0–3.0 mm

20-100 Pin Flexible Options

Low Insertion Loss

Wide Temperature Range: -40°C to +125°C

100% Full Electrical Performance Testing

Overview

In-depth Product Details & Applications

Solution Overview

5G base station equipment is comprised of multiple functional modules (RF, BB, PA, etc.), requiring high-density, high-speed interconnect channels between them. This solution utilizes high-performance BTB (Board-to-Board) connectors, featuring precise impedance control and advanced signal shielding designs to meet the stringent signal transmission requirements for 5G NR millimeter-wave and Sub-6GHz frequency bands.

Key Application Areas

RF Processing Unit: RF transceiver to front-end module connectivity, Power Amplifier (PA) control
Baseband Processing Unit: FPGA/DSP to accelerator card interconnects, Fronthaul interface (CPRI/eCPRI) connections
Antenna System: Beamforming control board connections, Phase shifter control, Antenna calibration interfaces
Small Cells / Micro Cells: Core board to RF board interconnects, Backhaul interfaces, Power management modules

Solution Advantages

Precise differential impedance control at 100Ω±10%; Crosstalk < -30dB @ 10GHz; Alignment pins assist self-alignment to improve placement yield; Dual-contact terminal redundancy design ensures long-term reliability.